上世纪90年代初开始，在美国、欧洲和日本等先后立法对铅在工业上的应用加以限制，并进行无铅焊料的研究与开发工作，我国对此也十分重视，许多高等院校、科研院所及有条件的企业，都在广泛开展研究与开发工作，取得了较好的成果，基本上与国际同步。
含铅焊料与铅合金涂覆工艺长期以来在电子产品制造技术中被广泛应用，尤其是Sn-Pb共晶焊料以其使用的方便性、稳定的焊接性、价格的合理性作为实用的低温合金，从古罗马时代开始直到当今高密度的电子组装，一直担任着最适宜的角色。但是由于大量电子产品废弃物及旧家用电器逐渐造成的铅污染，对人类生存的地球环境也造成很大的危害，从日前举办的第13届NEPCON展上展示的电子设备、电子材料来看，电子组装业已开始迈向一个适合绿色环保要求的新时期。无铅化电子组装工艺已成为新世纪电子制造业的开发和应用重点。
1990年美国提出了“在所有电子机器的广泛范围内禁止使用铅的法案”，由此世界范围内开始了电子组装业替代焊料(无铅焊料)的研发活动，并对替代焊料的各种应用稳定性、可靠性等进行了系列研究。
在目前的应用情况下，无铅化组装还留有一些技术课题，在使用特性、可焊性方面有以下几项：润湿性不如原来的Sn-Pb焊料；焊接作业性比原来的差；对波峰焊接会发生的Lift-off还没有完好的对策；焊点的耐腐蚀性问题；量产化的品质管理、工艺问题；接合后的长期可靠性等。
建立针对无铅化组装的简便式检测方法是亟待完善的任务。譬如无铅化组装焊点的外观检查，必须要建立外观检查的有关标准，对于整个行业来说，应该早日完成行业或国家标准。
无铅化组装的可靠性，一般来说无铅焊料难以发生蠕变，焊料本身同样具有良好的可靠性，组装时的不利因素主要来自组装元件和基板焊区的组装应力，这个方面的可行性认定，可以由企业自行展开，也可以通过专业学会，或企业间共同努力来推进。
在推行无铅化组装的过程中，要看到向无铅化转移时的时间偏差，如生产周期短的产品，完成无铅化可能会简单一些，周期长或多品种少批量的企业向无铅化转移的时间就会长一些。还有一个现象是，对于无铅化应用中的判断、评价，因为目前的应用标准还没有，要是不能及时完善，对产品向无铅化转移会变得不吻合。
无铅化的推广应用会带来应用成本的提升，但是作为一项全球化的应用趋势，作为整机厂商，对于无铅化的成本上升问题，应从综合的观点来考虑，最好是在保持产品性价比的基础上，消化吸引因无铅化技术引起的成本上升，这才是适应市场竞争的理性观点，也是整机厂、元件厂有待深入探讨的问题。
为了人类居住的地球环境，电子产品推行无铅化已是一个不可扭转的趋势，日、欧、美等国的产业研究所、专业学会曾专门就此事向广大市民、中小企业、跨国制造商作了无铅化调查，所得到的调查结果可归纳为下面几项。
大企业应该向中小企业提供或公示无铅化技术信息。跨国公司类的著名企业，因经济实力雄厚，可能会先行一步进入无铅化领域，但对于众多的中小企业，仅依靠自己的技术或力量，要一下进入实用无铅化领域，还会存在一些困难，希望已经进入无铅化技术的大企业能提供无铅应用技术信息，为全行业的无铅化作相应贡献。
对无铅焊料统一命名、制订相应标准。当前不管是已完成无铅化的元件厂商，还是焊料生产厂商，所设定的应用工艺、应用焊料名称是不统一的，这对于推广中会出现因供应厂商的不同，所提供的使用说明、技术确认方式也不同的局面，由此只会给无铅化的推进造成障碍。要彻底解决这个问题，在不同厂商之间期待于焊料组成、组装工艺条件、无铅焊接使用时间的规定等方面的统一是必要的。
国际标准化。关于无铅化国际标准的建立，众多厂商提出“建立向世界各国发布无铅化技术信息制度”、“在国际标准方案的制订上要采取主动权”、“向其他国家发布信息或技术转移的前提是应该设立无铅化公用方案”、“尽快设定世界性的推广应用方针，订出无铅化SCHEDULE”。这些意见对我们来说应该积极参考。
知识产权与国际协调。电子组装无铅化的专利，调查中跨国类公司发表了很多意见，代表性的有两点，一是要尽快建立无铅焊料的专利信息数据库，二是应设法使已有的美国专利经专业网站给予公布，以减少重复申请。
现在生产组织性跨国的大公司，基本是“世界性工厂”，这类公司生产新技术的应用，生产规模制订等，必须在不同国家子公司的协调下才能完成。同样推广无铅化计划必须要进行国际间的协调，同步展开才能取得相应效果。
关于无铅化的技术标准，从目前还在使用的铅锡焊料来说，在共晶焊料以外已有多种焊料标准，对应的作用也很广。铅锡焊料的特征反映在不同产品上的使用方便性，所以不一定要强制设立标准。对于无铅化推广来说，应用标准不一定是单一品种组成的统一，主要是指所限定焊料合金系的应用范畴与分类。例如日本NEDO的执行方案中已对无铅焊料 的标准分类有了提案。
与无铅化标准发生牵连的另一方面是元器件连接电极镀层(金属)是否同无铅焊料取得统一。对这个问题首先要搞清楚在组装基板焊区、元件电极与使用的无铅焊料间有没有等同性的必要。同类焊料和不同类元素混放时给产品会带来什么样的影响，同时也有待于权威性标准化组织在综合各方面的意见后提出相应的建议。
无铅化国际标准的建立对推动这项事业是有利的。目前公开的技术信息，专利文献还不是很多，但随着今后国际法规时间表推出，一定会形成一个适用性很强的标准框架。
无铅焊接应用案例
SONY(索尼)公司从1996年开始a研究无铅化组装工艺，并在无铅化的可靠性、量产性、成本性方面对Sn-Ag系、Sn-Zn系焊料进行了验证。在1999年的第三季度与500多家元器件制造销售商进行无铅化协商，签订了无铅实用化协议。
在无铅产品商品化推广中，2000年3月向市场推出DCR-TRV20数码摄录一体机。
NEC 从NEC公司的对外公告上获知，其2002年Sn-Pb焊料的使用量同1997 年相比削减50%。20 00年以来，NEC已在多种产品上执行了无铅化，于1999 年率先在笔记本电脑上进入量产化生产。
FUJITSU研究所
FUJITSU研究所于1999年10月发表了无铅化在“全球通信程序服务器GS8900”的应用。GS8900全球通信程序服务器中的MCM无铅化组装(分级焊接)，这种分级焊接无铅化方式今后还将在更多的高端产品中得到应用。
Panasonic
松下公司从1998年开始在便携式数码音频产品“MD”上进行了无铅化量产生产。近年来已形成P-MD 产品的无铅化系列。
Since the beginning of the 1990s, in the United States, Europe and Japan have legislation to limit the application of lead in the industry to be limited, and lead-free solder research and development work, our country also attaches great importance to many institutions of higher learning, scientific research Institutions and qualified enterprises, are in a wide range of research and development work, and achieved good results, basically with the international synchronization. The same time as
Lead-containing solder and lead alloy coating process has long been widely used in electronic product manufacturing technology, especially Sn-Pb eutectic solder with its convenience, stable welding, the price of rationality as a practical low-temperature alloys , From the ancient Roman era until today's high-density electronic assembly, has served as the most appropriate role. However, due to a large number of electronic products and old household appliances and lead gradually lead pollution, the human environment of the human environment also caused great harm, from the recently held at the 13th NEPCON show on the display of electronic equipment, electronic materials, Electronic assembly has begun to move towards a new era of green environmental requirements. Lead-free electronic assembly technology has become the new century, the development and application of electronic manufacturing focus. The same time as
In 1990, the United States proposed the Act on the Prohibition of the Use of Lead in the Extensive Range of All Electronic Machines, which began the development of alternative solder (lead-free solder) in the electronic assembly industry and the various applications of alternative solders Stability, reliability and so on a series of studies. The same time as
In the current application, the lead-free assembly also left some technical issues, the use of characteristics, solderability aspects of the following: wetting less than the original Sn-Pb solder; welding work than the original poor; The Lift-off of the wave soldering will not have a good countermeasure; the corrosion resistance of the solder joint; the quality management of the mass production, the process problem; the long-term reliability after the joining. The same time as
The establishment of a simple detection method for lead-free assembly is an urgent task. For example, the appearance of lead-free assembly of solder joints inspection, must establish the relevant standards of inspection, for the entire industry, should be completed early industry or national standards. The same time as
Lead-free assembly of the reliability, in general, lead-free solder is difficult to creep, the solder itself has the same good reliability, the assembly of the unfavorable factors mainly from the assembly components and substrate welding area of the assembly stress, this aspect of the feasibility Identified, can be launched by the enterprise itself, you can also learn through professional, or to work together to promote the enterprise. The same time as
In the process of lead-free assembly, to see the time shift to lead-free transfer, such as the short production cycle of the product, the completion of lead-free may be simple, long or many varieties of small batch of enterprises to no Lead transfer time will be longer. There is also a phenomenon, for the application of lead-free evaluation, evaluation, because the current application standards have not, if not timely improvement of the product to lead-free transfer will become inconsistent. The same time as
Lead-free application will bring the application of the cost of upgrading, but as a global application trends, as a whole machine manufacturers, the cost of lead-free rise, should be considered from a comprehensive point of view, it is best to maintain Product cost-effective on the basis of digestion and attracting lead-free technology caused by rising costs, this is to adapt to market competition rational point of view, but also machine factory, component plant to be further explored. The same time as
In order to human living in the global environment, the implementation of lead-free electronic products is an irreversible trend, Japan, Europe, the United States and other countries of the Institute of Industry, professional society has specialized on the matter to the general public, small and medium enterprises, multinational manufacturers The results of the survey can be summarized as follows. The same time as
Large enterprises should provide or publicize lead-free technical information to small and medium-sized enterprises. Multinational companies like the famous enterprises, due to economic strength, may be the first step into the field of lead-free, but for many small and medium enterprises, relying solely on their own technology or strength, to enter the field of practical lead-free, there will be some Difficult, hope that has entered the lead-free technology, large enterprises can provide lead-free application of technical information for the industry-wide lead-free contribution to the corresponding. The same time as
Lead free solder named after the formation of the corresponding standards. Whether the current has been completed lead-free component manufacturers, or solder manufacturers, set the application process, the application of solder name is not uniform, which will appear in the promotion due to the different manufacturers, provided instructions, Technical confirmation is also a different situation, which will only lead to lead to promote the obstacles. It is necessary to completely solve this problem, and it is necessary to unify the consistency between the different manufacturers and the requirements of the composition of the solder, the assembling process conditions and the lead-free soldering time. The same time as
International Standardization. On the establishment of international standards for lead-free, many manufacturers put forward the "establishment of the world to publish lead-free technology information system", "in the development of international standard programs to take the initiative", "to other countries to publish information or technology transfer The premise is that should be set up lead-free public program "," as soon as possible to set the world to promote the application of guidelines, made of lead-free SCHEDULE ". These comments should be a positive reference for us. The same time as
Intellectual Property and International Coordination. Electronic assembly of lead-free patent, the survey of multinational companies published a lot of opinions, there are two representative, one is to establish a patented information database as soon as possible lead-free solder, the second is to try to make the existing US patents by professional The website is given a notice to reduce duplicate applications. The same time as
Now the production of organized transnational large companies, the basic "world factory", the production of new technologies such companies, the scale of production, etc., must be coordinated in different countries to complete the subsidiary. The same promotion of lead-free plan must be carried out international coordination, synchronized to achieve the appropriate effect. The same time as
On the lead-free technical standards, from the currently used lead-tin solder, eutectic solder in addition to a variety of solder standards, the corresponding role is also very wide. The characteristics of the lead solder are reflected in the ease of use on different products, so it is not necessary to enforce the standard. For lead-free promotion, the application of standards is not necessarily a single species of unity, mainly refers to the limited scope of the application of solder alloy and classification. For example, Japan NEDO implementation of the program has been on the standard classification of lead-free solder with a proposal. The same time as
Another aspect related to lead-free standards is whether the electrode-attached electrode coating (metal) is united with lead-free solder. The first question on this issue is to find out whether there is any need for uniformity between the component electrodes and the lead-free solders used in assembling the substrate pads. Similar products and different types of elements mixed when the product will bring what kind of impact, but also to be authoritative standardization organizations in the comprehensive views of various aspects of the corresponding recommendations. The same time as
The establishment of international standards for lead-free to promote the cause is beneficial. The current disclosure of technical information, patent literature is not a lot, but with the future international regulatory timetable introduced, will form a very applicable standard framework. The same time as
Lead - free soldering applications
SONY (Sony) from 1996 to study a lead-free assembly process, and in the lead-free reliability, mass production, cost of Sn-Ag, Sn-Zn solder was verified. In the third quarter of 1999 with more than 500 components manufacturing and sales of lead-free consultation, signed a lead-free utility agreement. The same time as
In the lead-free product commercialization promotion, in March 2000 to market the market DCR-TRV20 digital camcorder. The same time as
NEC from NEC's external announcement that its 2002 Sn-Pb solder usage compared with 1997 reduced by 50%. Since 20 years, NEC has been in a variety of products on the implementation of the lead-free, in 1999 took the lead in the notebook computer into mass production. The same time as
FUJITSU Institute
The FUJITSU Institute published the lead-free application in the "Global Communications Program Server GS8900" in October 1999. GS8900 global communication program server MCM lead-free assembly (graded welding), this grading welding lead-free way in the future will be more high-end products in the application. The same time as
Panasonic
Matsushita Corporation since 1998 in the portable digital audio products "MD" on the lead-free production. In recent years has formed P-MD products lead-free series.
