2008年10月15-16日由国际电子工业连接协会IPC和深圳市创意时代会展有限公司共同举办的权威技术会议“IPCWorks Asia—无卤素/无铅：绿色制造的挑战”在深圳隆重举办。大会邀请了Dell、华为、确信电子-爱法（Cookson-Alpha）、确信电子-乐思化学（Cookson-Enthone）、美国铟公司（Indium）、汉高（Henkel）、泰科纳（Ticona）、斗山电子（Doosan）、德山金属（Duksan Hi-Metal）、通标（SGS）、斯倍利亚（Nihon Superior）等行业技术专家前来分享无铅无卤素制造技术和案例，IPC也就无卤素方面的新标准发表精彩演讲。
大会丰富的内容吸引了Sony、Tyco、3M、联想、艾默生、富士康、比亚迪、伟创力、中兴、华为、摩派、创维、珠海方正、研祥、台达电子、阿尔卡特、DELPHI、至卓飞高等国内外知名企业近200名技术人员、研发人员及管理人员出席。本次大会是国内电子制造业针对无铅无卤素制造技术的年度盛会，在业界推动绿色制造的新技术。
为了规范行业标准，更好地引导企业实现绿色制造，IPC经过在行业内经过调研，为一些相关标准做了更新，在本次大会上，IPC的培训经理杨蕾公布了IPC J-STD-709标准更新，内容主要围绕无卤素电子元件和组件材料中使用溴和氯最大限度的界定。在调研中，他们得知，以循环测试来检验BS EN14582是一个合适的测试方法，以确定IPC成员组织普遍使用的材料中氯和溴的全部含量。在今年在6月4号还订立了一个合并1&2级和3&4级的协议。例如一级的物品必须要一些要求，包括其它非PCB基材的构件，任何均质材料所含的溴（如果来源于溴化阻燃剂）和氯（如果来源于氯化阻燃剂和/或聚氯乙烯）必须低于900ppm。除此之外，在非溴化阻燃剂，氯化阻燃剂或聚氯乙烯的均质材料中，较高含量的溴和氯是允许的。这个标准的更新将会对元件和电子材料逐渐走向环保型起到促进作用，得到业界人士的一致认可。
通标标准技术服务有限公司也在关注业界无卤化发展趋势，SGS-CSTC高级技术主管韩奕在演讲中解读了主要针对卤系阻燃剂的各无卤化指标、法律法规和要求，同时阐述了未来无卤化的技术发展趋势。同时为电子电器制造厂“支招”，如何在节省环保成本的同时有效应对无卤化的问题，协助企业为其可持续性发展奠定坚实的基础。
随着全球电子工业对环保的要求越来越高，无铅制程越来越多地应用到电子工业中。确信电子-乐思化学的亚太区副产品经理李亚全在会上介绍了适用于无铅装配的OSP 膜的特性，并剖析了什么样的OSP才能符合无铅焊接制程的要求。
电子组装行业机构正在制定一些指引，许多消费者和供应商便在印刷电路板、焊接掩膜、模塑化合物、连接器和线缆中使用卤代化合物，确信电子集中了大量的研发资源研究出了不含卤化物和卤素的新产品以替代我们的传统的焊锡产品。确信电子–爱法技术总监阮金全介绍了电子业界上的无卤素组装材料，介绍一些在卤素测试和开发无卤素助焊剂和焊膏方面的最新进展。
电子封装逐渐走向无卤，无卤电子封装材料的研发和产品化最近变的火热。汉高乐泰(中国)有限公司产品研发高级经理吕道强在题为《无卤微电子封装材料的研发》的演讲中，重点讲解无卤焊料，粘胶，和環氧模塑料的研发。美国铟公司魏振喜也着重阐述了无卤素材料与测试方法的改进。
斗山电子先任硏究员申周浩介绍了该公司的新产品——高多层用High Tg 无卤素 FR-4，新开发的High Tg，无卤素FR-4 DS-7402H是代替以往溴系难燃料，适用了反应性引继难燃剂。新产品受到在场人士的一致认可。
液晶聚合物材料的全球供应商泰科纳(Ticona)使用自阻燃的耐高温材料——液晶聚合物(LCP)在许多应用中取得良好的效果，会议上中国区电子电气行业市场经理韩文煜与业内人士分享了在电子电气行业的无卤阻燃方案，可以在电子产品在做到无卤的同时，无需降低产品安全的标准。
DUKSAN HI-METAL德山金属对基于不同焊料合金以及焊垫精整的可靠性改善进行了研究，得出铜的含量高，有助于纾缓表面脆性的结论。 斯倍利亚贸易（上海）有限公司营业部经理魏峻在演讲中介绍了高可靠性的无铅BGA （SN100C SnCuNi-Ge）锡球。
戴尔公司高级环境顾问寿国辉先生介绍了戴尔公司以及相关限用物质法规要求，分析并评估了便携式笔记本电脑产品中溴化阻燃剂、聚氯乙烯的使用现状和无卤化方案，标明了戴尔公司立志成为全球最环保科技公司的承诺的无卤化立场。华为高级工程师朱爱兰介绍系统产品无铅化过程中将面临的挑战，包括材料应用的挑战、无铅工艺组装质量挑战、可靠性评估方法和产品可靠性的挑战高可靠性产品无铅化面临的挑战。
IPCWorks Asia是国际知名的技术研讨会活动，每次会议都会围绕一个电子制造业热门的主题展开。IPCWorks Asia 在2007年由IPC和创意时代首次引入中国，今年是第二次在中国举办，每年10月份在高交会电子展ELEXCON期间举行。
October 15-16, 2008 The IPCWorks Asia - Halogen / Lead - free: Green Manufacturing Challenge was held in Shenzhen by the International Federation of Electronics Industry Connecters IPC and Shenzhen Creative Time Exhibition Co., Ltd. The conference invited Dell, Huawei, convinced that Cookson-Alpha, Cookson-Enthone, Indium, Henkel, Ticona, Doosan, Duksan Hi-Metal, SGS, Nihon Superior and other industry experts have come to share lead-free halogen-free manufacturing technology and cases. The new standard in halogen is a wonderful lecture.
The rich content of the conference attracted Sony, Tyco, 3M, Lenovo, Emerson, Foxconn, BYD, Flextronics, ZTE, Huawei, Mosque, Skyworth, Zhuhai Founder, EVOC, Delta Electronics, Alcatel, DELPHI, Well-known enterprises at home and abroad nearly 200 technical staff, research and development personnel and management personnel to attend. The conference is the domestic electronics manufacturing industry for lead-free halogen-free manufacturing technology of the annual event, in the industry to promote green manufacturing of new technologies.
In order to standardize the industry standard, to better guide enterprises to achieve green manufacturing, IPC through the industry through research, for some relevant standards to do the update, in this conference, IPC training manager Yang Lei published IPC J-STD-709 Standard update, the content mainly around the halogen-free electronic components and components in the use of bromine and chlorine materials to maximize the definition. In the survey, they learned that testing the BS EN14582 with a cyclic test was a suitable test method to determine the total content of chlorine and bromine in the materials commonly used by IPC member organizations. In this year on June 4 also entered into a merger 1 & 2 and 3 & 4 level agreement. For example, a class of items must require some requirements, including other non-PCB substrate components, any homogeneous material contained in the bromine (if derived from brominated flame retardants) and chlorine (if derived from chlorinated flame retardants and / Or polyvinyl chloride) must be less than 900 ppm. In addition, higher levels of bromine and chlorine are allowed in non-brominated flame retardants, chlorinated flame retardants or polyvinyl chloride homogeneous materials. This standard update will be on the components and electronic materials gradually play a role in promoting environmental protection, the industry has been unanimously approved.
SGS-CSTC senior technical director Han Yi in the speech interpretation of the main halogen-based flame retardants for the halogen-free indicators, laws and regulations and requirements, and elaborated on the Future Halogenated Technology Development Trends. At the same time for the electrical and electronic factory "Weapon", how to save environmental costs at the same time effective response to halogen-free problems, to help enterprises for its sustainable development and lay a solid foundation.
With the global electronics industry increasingly high demand for environmental protection, lead-free process more and more applied to the electronics industry. The Asia-Pacific By-product Manager, Li Yaquan, who presented the benefits of the lead-free assembly, introduced the characteristics of the OSP film for lead-free assembly and analyzed what OSPs could meet the requirements for lead-free soldering processes.
Electronic assembly industry organizations are developing guidelines for many consumers and suppliers to use halogenated compounds in printed circuit boards, solder masks, molded compounds, connectors and cables, and believe that electronics focus on a large number of R & D resources Halogen-free and halogen-free new products to replace our traditional solder products. Convinced that the electronic - love law technical director Ruan Jinquan introduced the electronics industry halogen-free assembly materials, introduced some in the halogen testing and development of halogen-free flux and solder paste the latest progress.
Electronic packaging gradually to halogen-free, halogen-free electronic packaging materials, research and development and product of the recent changes in the fiery. In the speech entitled "R & D of Halogen-free microelectronic packaging materials", Lu Raoqiang, Senior Manager of R & D of Henkel Loctite (China) Co., Ltd., focused on the development of halogen-free solder, viscose, and epoxy molding compounds. US indium company Wei Zhenxi also highlighted the improvement of halogen-free materials and test methods.
The newly developed High Tg, halogen-free FR-4 DS-7402H is a substitute for the previous bromide-based fuels, which is a new product of high-temperature non-halogen FR-4, Applicable to reactive fuels. New products by the presence of people unanimously approved.
Ticona, a global supplier of liquid crystal polymer materials, has achieved good results in many applications using self-igniting high temperature resistant materials - liquid crystal polymer (LCP). At the conference, China's electronics and electrical industry market manager, Han Wenyu And the industry to share in the electrical and electronic industry, halogen-free flame retardant program, you can do in the electronic products at the same time, without the need to reduce product safety standards.
DUKSAN HI-METAL Dehan metal has studied the improvement of reliability based on different solder alloy and pad finishing, and concluded that copper content is high and helps to relieve surface brittleness. Speaking at the Speech, the manager of the business department of Pennsylvania Trading (Shanghai) Co., Ltd. introduced a highly reliable lead-free BGA (SN100C SnCuNi-Ge) solder ball.
Mr. Shouguo Hui, Senior Environmental Advisor of Dell, introduced Dell's and related restricted substances regulations to analyze and evaluate the use of brominated flame retardants, polyvinyl chloride and halogen-free solutions in portable notebook products, The company determined to become the world's most environmentally friendly technology company's commitment to halogen-free position. Huawei's senior engineer, Zhu Ailan, describes the challenges that will lead to the lead-free process of the system, including the challenges of material application, the challenges of lead-free process assembly challenges, reliability assessment methods and product reliability challenges. High-reliability products Lead-free challenges The
IPCWorks Asia is an internationally renowned technology seminar, each meeting will focus on a popular topic of electronic manufacturing started. IPCWorks Asia was first introduced to China in 2007 by IPC and the Creative Era, this year is the second time in China, held in October each year at the fair trade show ELEXCON.
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